RUBIG can measure the residual stresses of your workpieces. Particularly for component optimizations aimed at increasing long life fatigue strength or for endurance strength calculations and for dynamic fatigue testing, etc., knowledge regarding the level and profile of residual stresses is absolutely crucial.
The most reliable and most accurate method for measuring residual stress is the X-ray diffractometer analysis (RDA) according to DIN EN 15305.
- Due to the structure of the RDA, not only small samples but also larger components can be tested
- Small test surfaces (Ø 0.3 … 5 mm) are measurable
- Residual stress profiles: The measurement of residual stresses gains significance when a depth profile is adopted. For this, the material is removed electrochemically in the surface area of the component. In this process, no further mechanical stresses are introduced that can falsify the result.